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‘Build Back the Wisconsin Paper Industry’ event announced

Hosted by the Green Bay Innovation Group, it takes place March 2, 2023, at Johnsonville Tailgate Village by Lambeau Field.

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By: Steve Katz

Associate Editor, Label & Narrow Web

The Green Bay Innovation Group has announced the Build Back the Wisconsin Paper Industry event, which takes place March 2, 2023 at the Johnsonville Tailgate Village by Lambeau Field in Green Bay, WI, USA.

The event runs from 7:00 AM to 4:00 PM. The cost is $40.00 per person and lunch is included. To register, visit  www.greenbayinnovationgroup.com.

Featured keynote speakers: 

  • Marty Ochs, executive director of the Green Bay Innovation Group – Host
  • Jerimiah Janssen, vice president of First Business Bank – Sponsor
  • Brit Swisher, Midland Paper, area vice president – Northern Region 
  • Michelle LeMere, vice president of Engineered Specialties at Pixelle Specialty Solutions  
  • Congressman Tom Tiffany of Wisconsin
A panel discussion will also take place, featuring:
  • Jim Koronkiewicz, general manager at BPM, Inc.  
  • Michelle LeMere, VP Pixelle Specialty Solutions
  • Nick Mares, president of Virdiam  
  • Henry Schienebeck, executive director of the Great Lakes Timber Association  
  • Paul Fowler, Wisconsin Institute for Sustainable Technology at UW Stevens Point
  • Daniel Leeson, director of national sales, Western States Envelope & Labels
Special invited guests include: Scott Suder, president of the Wisconsin Paper Council; Sam Riikers, COO of WEDC; Barb LaMue, president of The New North; Kelly Armstrong, vice president at Greater Green Bay Chamber; and Ann Franz of New Manufacturing Alliance.  
















 

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